Huh TIL. Strange that they didn’t fix the issue with the 360 slims, because they got pretty hot quick too. I guess maybe they didn’t realize how bad it was until later.
Apparently the S model was more resilient to the solder joints breaking, but still had a somewhat inadequate cooling solution. That article goes into more detail, which basically comes down to Microsoft tried to save money by doing all the design in-house, and ended up botching the whole thing, under testing it, and doing last minute changes (like the addition of a Hard Drive, which modified the airflow negatively, so they put some extra holes in it, but ultimately said “fuck it, ship it out”.
Huh TIL. Strange that they didn’t fix the issue with the 360 slims, because they got pretty hot quick too. I guess maybe they didn’t realize how bad it was until later.
Apparently the S model was more resilient to the solder joints breaking, but still had a somewhat inadequate cooling solution. That article goes into more detail, which basically comes down to Microsoft tried to save money by doing all the design in-house, and ended up botching the whole thing, under testing it, and doing last minute changes (like the addition of a Hard Drive, which modified the airflow negatively, so they put some extra holes in it, but ultimately said “fuck it, ship it out”.